WIO UP Socket E 8x DDR5, 10x NVMe5

Key Features

• 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
• Intel C741® Chipset
• Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots
• 1 PCIe 5.0 x8 ( in x16)
  1 PCIe 5.0 x32
  M.2 Interface: 1 PCIe 3.0 x2
  M.2 Form Factor: 2280, 22110
  M.2 Key: M-Key
• 10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors
• X13SEW-F: Dual LAN with 1GbE with Intel® I210
  X13SEW-TF: Dual LAN with 10GBase-T with Intel® X550
• 2 SuperDOM with built-in power
• I/O: 1 VGA, 2 COM, 1 TPM header
• 4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A)
• Intel® C741 controller for 10 SATA3 (6 Gbps) ports